We are focused on wafer-handling, glas-handling and film-handling. Beyond we offer special-purpose solutions for many handling tasks.

Our technology is used in any industry concerning ultra-pure handling. We set the standards in avoiding surface damages, reducing particle generation and contamination.

We are experts in non-contact handling. Thus we are leading in vibration engineering, mechanical engineering and electronics.

The ultrasound-air-bearing technology enables:

• completely new process-design with huge potential concerning yield, total-cost-of-ownership, energy consumption and simplification of process-chains.
• reduction of wafer-brakeage, surface-damage and contamination
  
• higher quality.