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Semiconductor Wafer-Handling
Chuck  

Semiconductor Wafer-Chuck

Wafer Positioning / Rotating

Our wafer handling systems use ultrasound-air-bearing and can be applied in any atmospheric process. The ultrasound air bearing generates a supporting gas film (air or process-gas) between surfaces and substrates. Wafers hover, friction-free, on a supporting gas film at a height of 100 µm, therefore 4 side-stop-pins (2 are movable) are required to afix the wafer laterally. in situations of extreme flatness (e. g. for thin-wafers), the chuck can be pre-loaded with a vacuum, while the ultrasound maintains the gap.

 

 

The principle of the ultrasound air film technology

Our handling systems use ultrasound-air-bearing and can be applied in any atmospheric process. The ultrasound-air-bearing generates a supporting gas film (air or process-gas) between surfaces and substrates, therefore, any mechanical contact is avoided. The substrate hovers on a supporting gas film.

 
Technical Data
Electrical Equipment max. 30 W, 230/110 V~ (ultrasound)
Surface materials available Anodized aluminium
Teflon-coated aluminium
Quarz-glass
Distance (tool-substrate) ~100 μm
Substrate sizes 100 - 450 mm / 4 - 18
 
Your Benefits
  • No surface damages due to non-contact handling
  • No particle deposition
  • No influence on your clean room conditions
  • High planarity of the substrate during transfer process
Applications
  • Wafer inspection
  • Wafer processing
Highlights
  • Non mechanical contact between the tool and the substrate
  • Handling at processed / coated surfaces
  • Top-side handling (special design)
Products to be combined
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