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Photovoltaic Wafer-Handling
PV Zusammenführung  


Concentrating PV-wafers and cells from several to one track


Due to the equilibrium of forces between low pressure, ultrasound and gravity, wafers can be gripped from the top-side and transferred by a conveyor belt.

Once the wafer is above its target position, the low pressure is turned off. The repelling ultrasound force slides the wafer to either a magazine, or its target position and then gently dropped. Substrates can be sorted by many different kinds of container systems, like cassettes, carriers, matrixcarriers, stacks or conveyor belts.



The principle of the ultrasound- air-film technology


Our wafer handling systems use ultrasound-air-bearing and can be applied in any atmospheric process. The ultrasound-air-bearing generates a supporting gas film (air or process-gas) between surface and the substrate, therefore, any mechanical contact is avoided. The substrate hovers on a supporting gas film.

Technical Data
Air Consumption 40 l/min, 40 mbar
Electrical Equipment max.100 W / 230 V (Ultrasound)
max. 200 W / 230 V (Low Pressure)
max. 40 W / 24 V= (Drives)
Interfaces available PROFIBUS, PROFINET, EtherCAT, OPC
Distance (tool-substrate) ~100 μm
Loading Capacity customized
Cycle Time (Throughput) 0.5 s/Wafer (2 Wafer/s) / max. 4500 wafers/h
Your Benefits
  • Lowest breakage-rate (< 70 ppm)
  • Higher throughput (4500 wafers/s) / short cycle times
  • Lowest energy consumption
  • Modular design for more degrees of freedom in process and machine design
  • Wafer concentrating
  • Unloading of Belts
  • Pick&place processes
  • Picking: Up to 2 wafers/s (0,5 s / wafer)
  • Non mechanical contact between the tool and the substrate
  • Suitable for thin wafers down to 100 μm
  • Picking / separation distance up tp 12 mm
Products to be combined
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