Photovoltaic Wafer-Picker-Module

Our wafer handling systems using the ultrasound air bearing can be applied in any atmospheric process. The ultrasound aur bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. Thus, any mechanical contact is avoided. The substrate is hovering on the supporting gas-film.


Wafer Separation and Pick-Up Process

The ultrasound air bearing facilitates a separation / gripping process without any moving tool-parts. The most important advantages aside from the ultra-safe non-contact gripping are significantly lower cycle-times (higher throughput) compared to state of the art pick & place processes.


Especially adapted blowing-units singularize the uppermost wafers of the stack. Thus the topmost wafer is brought into the near-field of the ultrasound vacuum picker unit. The substrate is attracted smoothly towards the transfer unit. The distance between wafer and sonotrode is 100 - 300 μm.

Air Consumption 40 - 80 l/min (separation)
Low Pressure 120 l/min, 40 mbar
Electrical Equipment max.50 W, 230 V (ultrasound)
20 W, 24 V (drives)
Distance (tool-substrate) 100 - 300 μm
Cycle Time 2 wafers/s (0,5 s/wafer)
Interfaces available PROFIBUS, PROFINET, EtherCAT, OPC
  • Lowest breakage-rate (< 70 ppm)
  • Higher throughput / short cycle times
  • Lower energy consumption
  • Modular design
  • Wafer separation
  • Unloading
  • Pick & place processes
  • 2 wafers/s (0,5 s/wafer)
  • No mechanical contact between the tool and the substrate
  • Suitable for thin wafers down to 100 μm
  • Picking / separation distance up tp 12 mm