„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

zs-handling LeviSolar Greifer

LeviSolar-Gripper

CONTACTLESS TOPSIDE GRIPPING
OF SOLAR WAFERS

 

The LeviSolar-Gripper enables contactless gripping and depositing of solar wafers. Our technology guarantees the ultragentle and ultra-clean handling of the sensitive surfaces.

When gripping the wafer, a combination of vacuum and ultrasound is used. The vacuum provides the attraction of the wafer and the ultrasound keeps the workpiece, with its repelling effect, at distance. Thus, no points of contact occur between the wafer and the gripper, and gentle handling is ensured.

The LeviSolar-Gripper is available for different wafer sizes. The edge stops support the wafer to center itself and to stay in position.

Features of the LeviSolar-Gripper:

  • High-precision pick and place
  • Contactless overhead lifting
  • No carry-over of impurities and no micro scratches
  • No need for compressed air
LeviSolar Greifer Detailansichten, ZS-Handling

Applications

Wafer und Chips

Processes

Be- und entladen greifen Sorting Separating

Further Information
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ZS-Handling Technologies GmbH • Budapester Straße 2 • 93055 Regensburg (Germany) • T: +49 941 60389 900 • F: +49 941 60389 999

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