CONTACTLESS TOPSIDE GRIPPING
OF SOLAR WAFERS
The LeviSolar-Gripper enables contactless gripping and depositing of solar wafers. Our technology guarantees the ultragentle and ultra-clean handling of the sensitive surfaces.
When gripping the wafer, a combination of vacuum and ultrasound is used. The vacuum provides the attraction of the wafer and the ultrasound keeps the workpiece, with its repelling effect, at distance. Thus, no points of contact occur between the wafer and the gripper, and gentle handling is ensured.
The LeviSolar-Gripper is available for different wafer sizes. The edge stops support the wafer to center itself and to stay in position.
Features of the LeviSolar-Gripper:
- High-precision pick and place
- Contactless overhead lifting
- No carry-over of impurities and no micro scratches
- No need for compressed air