CONTACTLESS INSPECTION OF SUBSTRATES
The LinearLevi-Inspectionmodule enables the inspection of substrates during the contactless transport. It is possible to check the quality of battery cells, foils, packaging, as well as wafers and chips without interrupting the transfer process.
No scratches on the substrate during the transport
There is the opportunity to subsequently sort the substrates according to the inspection results. The application can be delivered in different versions. For example, combinations with the UltraLevi-Desk for contactless transport are possible.
During the ultrasonic handling process, the substrate is kept plane, which provides a high flatness.
Features of the LinearLevi-Inspectionmodule:
- Various sizes
- No particles due to no air turbulence
- Double-sided inspection possible
- High flatness, also for flexible substrates
- Customizable according to customer specifications