„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

zs-handling Modulares Waferhandlingsystem

Modular Waferhandling-System

CONTACTLESS HANDLING OF WAFERS

 

The modular Waferhandling-System facilitates all possible handling processes of wafers.

Loading and unloading, conveying, gripping, inspecting, sorting and singulating can be realized in one system.

No contact with the wafer during the handling in the system

Our Ultrasonic Suspension Technology keeps the wafer on distance the whole time and therefore prevents micro-scratches and contamination.

Features of the Modular Waferhandling-System:

  • Modular Design
  • Suitable for clean rooms
  • Customizable according to customer specifications
  • Linking various processes in one system

Applications

Wafers und Chips

Processes

Be- und entladen fördern greifen inspizieren sortieren vereinzeln

Further information
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ZS-Handling GmbH • Budapester Straße 2 • 93055 Regensburg • T: +49 941 60389 900 • F: +49 941 60389 999

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